Lapping Machine

We handle Hamai Industries' grinding equipment models 13B to 32B. These models have a proven track record of successful deliveries to most semiconductor wafer manufacturers in China.

Lapping Plate

We offer industry-leading graphite cast iron surface plates and adjustment carriers (16B to 32B), along with a range of consumables for grinding operations.

Profile Measurement System

This device is a precision measurement tool that manages the flatness of grinding plates through surface profiling. Capable of measuring both upper and lower plates, it offers a measurement range of 1000mm to 3500mm.

Slurry Recycle Machine

This device efficiently recovers and regenerates usable abrasive materials from spent slurry used in silicon wafer polishing, allowing for effective reuse.